About the Journal

		Journal title	:	TechPedia: Journal of Engineering and Applied Technology
		Initials	:	TechPedia
		Abbreviation	:	TechPedia J. Eng. Appl. Technol.
		Frequency	:	January, April, July, October
		DOI	:	https://doi.org/10.55681/aspirasidigital by Crossref
		Online ISSN	:	xxxx-xxxx
		Editor-in-Chief	:	Ahmad Hadi Pranoto, S.Pd.,M.Pd.
		Publisher	:	LPPM Institut Pendidikan Nusantara Global
		Citation Analysis	:	[Sinta] [Google Scholar]

TechPedia: Journal of Engineering and Applied Technology is a peer-reviewed, open-access international journal dedicated to publishing pioneering research and disruptive innovations at the forefront of modern engineering and applied sciences. Positioned at the convergence of structural design, computational workflows, and industrial optimization, the journal serves as an authoritative scholarly forum for engineers, applied technologists, material scientists, and industrial developers worldwide. TechPedia prioritizes macro-level systemic frameworks, rigorous experimental and numerical validations, and scalable engineering methodologies that address complex, real-world technical challenges. By bridging raw laboratory technical discoveries with actionable industrial manufacturing applications, the journal fosters a deep, comprehensive understanding of engineering efficiency, automation, and technological longevity in an era of rapid technological acceleration.

Scope and Topics

The journal welcomes high-quality original research articles, critical reviews, and short communications that offer significant contributions to the following thematic areas:

• Mechanical Engineering & Industrial Automation: Advanced manufacturing systems, smart robotics, cyber-physical systems, thermodynamics, fluid dynamics, and mechanics of materials.

• Electrical, Electronics & Computer Engineering: Power systems and smart grids, embedded systems, microelectronics, wireless communication networks, and adaptive signal processing.

• Civil, Structural & Environmental Infrastructure: Sustainable construction materials, structural health monitoring, seismic engineering, geotechnics, and urban resilient infrastructure design.

• Chemical & Materials Process Engineering: Synthesis of advanced polymers and composite materials, chemical process intensification, nanotechnology applications, and metallurgy.

• Applied Computing & Industrial Informatics: Internet of Things (IoT) architectures, engineering optimization algorithms, data-driven predictive maintenance, and computational modeling in engineering.

Publication Frequency

To ensure rigorous editorial oversight, thorough peer review, and timely dissemination of cutting-edge engineering solutions, TechPedia is published semi-annually (2 issues per year, typically scheduled for release in June and December). Special thematic issues focusing on emerging paradigms such as Smart Manufacturing breakthroughs, Next-Gen Infrastructure, or Industrial Automation benchmarks may be commissioned by the Editorial Board.

Peer Review Process

TechPedia enforces a strict double-blind peer review policy to maintain the highest standards of technical validity, empirical accuracy, and academic integrity.

1. Initial Desk Evaluation: Every submission undergoes a preliminary screening by the Editor-in-Chief or a relevant Technical Editor to evaluate thematic alignment, methodological soundness, and structural compliance. Plagiarism screening via Turnitin/iThenticate is strictly executed at this stage, requiring a similarity index below the journal's maximum threshold.

2. Expert Peer Review: Manuscripts passing the desk evaluation are anonymized and assigned to at least two independent international reviewers who are established experts in the specific engineering or technical sub-discipline.

3. Editorial Decision: Based on the reviewers' recommendations, the Editorial Board renders one of four decisions: Acceptance, Revisions Required (Minor/Major), Resubmit for Review, or Rejection. The final decision rests entirely on the empirical merit, mathematical and experimental reproducibility, and practical engineering impact of the work.

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Mission Statement: "The mission of TechPedia is to deconstruct complex technical barriers and catalyze secure, sustainable engineering solutions within an increasingly automated global industry. Grounded in the philosophy that robust engineering and applied technology are the absolute anchors for economic stability, environmental safety, and human prosperity, the journal aims to democratize advanced technical knowledge by providing an unrestricted, high-impact platform for global scholarly dialogue. Through the promotion of diverse and rigorous methodological approaches—encompassing empirical laboratory experimentation, advanced numerical simulations, and predictive field case studies—TechPedia seeks to empower technology architects, inspire corporate developers, and shape future-proof industrial standards worldwide."